Measurement and analysis of thermal stresses in 3D...

Microelectronics Reliability 2013 / 1 Vol. 53; Iss. 1

Measurement and analysis of thermal stresses in 3D integrated structures containing through-silicon-vias

Jiang, Tengfei, Ryu, Suk-Kyu, Zhao, Qiu, Im, Jay, Huang, Rui, Ho, Paul S.
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
53
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2012.05.008
Date:
January, 2013
File:
PDF, 1.88 MB
english, 2013
Conversion to is in progress
Conversion to is failed