Effect of solder pads on the fatigue life of FBGA memory...

Microelectronics Reliability 2013 / 12 Vol. 53; Iss. 12

Effect of solder pads on the fatigue life of FBGA memory modules under harmonic excitation by using a global–local modeling technique

Cinar, Yusuf, Jang, Jinwoo, Jang, Gunhee, Kim, Seonsik, Jang, Jaeseok
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Volume:
53
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2013.06.018
Date:
December, 2013
File:
PDF, 3.27 MB
english, 2013
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