Comparison study on reliability performance for polymer core solder balls under multiple reflow and HTS stress tests
Kar, Yap Boon, Hui, Tan Cai, Agileswari, Ramasamy, Lo, CalvinVolume:
53
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2012.07.032
Date:
January, 2013
File:
PDF, 1.62 MB
english, 2013