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Effects of moisture absorption on anisotropic conductive films interconnection for flip chip on flex applications
Yin, C.Y., Lu, H., Bailey, C., Chan, Y.C.Volume:
107
Language:
english
Journal:
Microelectronic Engineering
DOI:
10.1016/j.mee.2013.02.070
Date:
July, 2013
File:
PDF, 1.73 MB
english, 2013