Volume 107

Microelectronic Engineering

Volume 107

1

56nm pitch Cu dual-damascene interconnects with self-aligned via using negative-tone development Lithography-Etch-Lithography-Etch patterning scheme

Loquet, Yannick, Mignot, Yann, Waskiewicz, Christopher, Chen, James Hsueh-Chung, Sankarapandian, Muthumanickam, Chen, Shyng-Tsong, Flaitz, Philip, Tomizawa, Hideyuki, Tseng, Chia-Hsun, Beard, Marcy, M

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 1.88 MB

english, 2013

2

Impact of wavelength of UV light and UV cure time on chemical and mechanical properties of PECVD deposited porous ultra low-k films

Godavarthi, S., Le, Q.T., Verdonck, P., Mardani, S., Vanstreels, K., Van Besien, E., Baklanov, M.R.

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 543 KB

english, 2013

3

Silicided Au/Ni bilayer on p-type [001] silicon for low contact resistance metallization schemes

Badalà, Paolo, Santangelo, Antonello, Pellegrino, Giovanna, Alberti, Alessandra

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 930 KB

english, 2013

4

Study of electromigration void nucleation time in Cu interconnects with doping elements

Arnaud, Lucile, Lamontagne, P., Bana, F., Le Friec, Y., Waltz, P.

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 1.49 MB

english, 2013

5

In-situ analysis on the initial growth of ultra-thin ruthenium films with atomic layer deposition

Geidel, Marion, Junige, Marcel, Albert, Matthias, Bartha, Johann W.

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 948 KB

english, 2013

6

Evaluation of plasma parameters on PEALD deposited TaCN

Piallat, Fabien, Beugin, Virginie, Gassilloud, Remy, Michallon, Philippe, Dussault, Laurent, Pelissier, Bernard, Asikainen, Timo, Maes, Jan Willem, Martin, François, Morin, Pierre, Vallée, Christophe

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 1.15 MB

english, 2013

7

Synthesis of carbon nanotubes and graphene for VLSI interconnects

Robertson, J., Zhong, G., Esconjauregui, S., Zhang, C., Hofmann, S.

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 3.66 MB

english, 2013

8

Tin assisted transfer of electroplated metal nanostructures and its application in flexible chiral metamaterials

Fang, Liang, Wei, Ming, Wongkasem, Nantakan, Jaradat, Hamzeh, Mokhlis, Anas, Shen, Jia, Akyurtlu, Alkim, Marx, Kenneth, Barry, Carol, Mead, Joey

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 1.62 MB

english, 2013

9

Barrier heights engineering of Al/p-Si Schottky contact by a thin organic interlayer

Huang, Wen Chang, Lin, Tien-Chai, Horng, Chia-Tsung, Chen, Chien-Chou

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 662 KB

english, 2013

10

Ag contact on sol–gel processed MgZnO film

Huang, Wen-Chang, Lin, Tien-Chai, Hsien, Tsung-Lieh, Tsai, Meng-Hua, Horng, Chia-Tsung, Kuo, Tsung-Lin

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 773 KB

english, 2013

11

Towards CMOS-compatible single-walled carbon nanotube resonators

Pathangi, H., Cherman, V., Khaled, A., Soree, B., Groeseneken, G., Witvrouw, A.

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 440 KB

english, 2013

12

Copper oxide atomic layer deposition on thermally pretreated multi-walled carbon nanotubes for interconnect applications

Melzer, Marcel, Waechtler, Thomas, Müller, Steve, Fiedler, Holger, Hermann, Sascha, Rodriguez, Raul D., Villabona, Alexander, Sendzik, Andrea, Mothes, Robert, Schulz, Stefan E., Zahn, Dietrich R.T., H

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 1.84 MB

english, 2013

13

Roll-to-flat texturing system with infrared preheating for manufacturing a microfluidic device

Jeong, Hyeonsoo, La, Moonwoo, Park, Sung Jea, Kim, Dong Sung

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 1.71 MB

english, 2013

14

Highly IR-transparent microfluidic chip with surface-modified BaF2 optical windows for Infrared Microspectroscopy of living cells

Mitri, E., Pozzato, A., Coceano, G., Cojoc, D., Vaccari, L., Tormen, M., Grenci, G.

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 894 KB

english, 2013

15

Advanced wafer thinning technology and feasibility test for 3D integration

Kim, Young Suk, Maeda, Nobuhide, Kitada, Hideki, Fujimoto, Koji, Kodama, Shoichi, Kawai, Akihito, Arai, Kazuhisa, Suzuki, Kousuke, Nakamura, Tomoji, Ohba, Takayuki

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 1.44 MB

english, 2013

16

Formation of NiGe through germanium oxide on Ge(001) substrate

Nemouchi, F., Carron, V., Lábár, J.L., Vandroux, L., Morand, Y., Morel, T., Barnes, J.P.

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 1.85 MB

english, 2013

17

Atomic layer deposition for high aspect ratio through silicon vias

Knaut, Martin, Junige, Marcel, Neumann, Volker, Wojcik, Henry, Henke, Thomas, Hossbach, Christoph, Hiess, André, Albert, Matthias, Bartha, Johann W.

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 1.67 MB

english, 2013

18

Magneto-optical Kerr effect studies of Cu2O/nickel heterostructures

Salvan, Georgeta, Robaschik, Peter, Fronk, Michael, Müller, Steve, Waechtler, Thomas, Schulz, Stefan E., Mothes, Robert, Lang, Heinrich, Schubert, Christian, Thomas, Senoy, Albrecht, Manfred, Zahn, Di

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 1.90 MB

english, 2013

19

A method for simulating Atomic Force Microscope nanolithography in the Level Set framework

Filipovic, Lado, Selberherr, Siegfried

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 1.69 MB

english, 2013

20

Reliability estimation and failure mode prediction for 3D chip stacking package with the application of wafer-level underfill

Lee, Chang-Chun, Yang, Tsung-Fu, Wu, Chih-Sheng, Kao, Kuo-Shu, Cheng, Ren-Chin, Chen, Tai-Hong

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 3.20 MB

english, 2013

21

New method to evaluate materials outgassing used in MEMS thin film packaging technology

Savornin, B., Baillin, X., Blanquet, E., Nuta, I., Saint Patrice, D., Nicolas, P., Charvet, P.L., Pornin, J.L.

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 392 KB

english, 2013

22

Table of Contents

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 144 KB

english, 2013

23

Threshold-switching characteristics of a nanothin-NbO2-layer-based Pt/NbO2/Pt stack for use in cross-point-type resistive memories

Kim, Seonghyun, Park, Jubong, Woo, Jiyong, Cho, Chunhum, Lee, Wootae, Shin, Jungho, Choi, Godeuni, Park, Sangsu, Lee, Daeseok, Lee, Byoung Hun, Hwang, Hyunsang

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 1.13 MB

english, 2013

24

Investigation of solder crack behavior and fatigue life of the power module on different thermal cycling period

Hung, Tuan-Yu, Huang, Chao-Jen, Lee, Chang-Chun, Wang, Chin-Chun, Lu, Keng-Cheng, Chiang, Kuo-Ning

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 1012 KB

english, 2013

25

MAM 2012 (selected contributions) March 11–14, Grenoble, France Minatec Campus

MAITREJEAN, Sylvain, FARCY, Alexis, CHEVOLLEAU, Thierry

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 751 KB

english, 2013

26

Direct observation of the diffusion layer during copper electrodeposition

Yuan, Boyu, Li, Wei, Zhang, Xiaoyan, Wang, Chao, Li, Liang

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 964 KB

english, 2013

27

Investigation of different methods for isolation in through silicon via for 3D integration

Sage, Stéphane, John, Peggy, Dobritz, Stephan, Börnge, Jochen, Vitiello, Julien, Böttcher, Matthias

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 843 KB

english, 2013

28

Ultrathin epitaxial Ni-silicide contacts on (100) Si and SiGe: Structural and electrical investigations

Zhao, Qing-Tai, Knoll, Lars, Zhang, Bo, Buca, Dan, Hartmann, Jean-Michel, Mantl, Siegfried

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 1.97 MB

english, 2013

29

Direct observation of Ni decorated dislocation loops within As+-implanted silicon and arsenic clustering in Ni silicide contact

Hoummada, Khalid, Tellouche, Gamra, Blum, Ivan, Portavoce, Alain, Descoins, Marion, Mangelinck, Dominique

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 4.03 MB

english, 2013

30

Synthesis of bimetallic nanoparticles in ionic liquids: Chemical routes vs physical vapor deposition

Helgadottir, I.S., Arquillière, P.P., Bréa, P., Santini, C.C., Haumesser, P.-H., Richter, K., Mudring, A.-V., Aouine, M.

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 775 KB

english, 2013

31

Reliability of chip on glass module fabricated with direct printing method

Lee, Young-Chul, Kim, Jong-Woong, Kim, Yongil, Jung, Seung-Boo

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 2.61 MB

english, 2013

32

Pt redistribution in N-MOS transistors during Ni salicide process

Panciera, F., Hoummada, K., Gregoire, M., Juhel, M., Mangelinck, D.

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 1.96 MB

english, 2013

33

Electro-mechanical studies of micro-tube insertion into Al–Cu pads for 10μm pitch interconnection technology and 3D applications

Goubault de Brugière, B., Marion, F., Fendler, M., Mandrillon, V., Hazotte, A., Volpert, M., Ribot, H.

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 1.59 MB

english, 2013

34

DC and low-frequency noise behavior of the conductive filament in bipolar HfO2-based resistive random access memory

Maccaronio, V., Crupi, F., Procel, L.M., Goux, L., Simoen, E., Trojman, L., Miranda, E.

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 1.37 MB

english, 2013

35

Atom probe tomography of SRAM transistors: Specimen preparation methods and analysis

Panciera, F., Hoummada, K., Gregoire, M., Juhel, M., Lorut, F., Bicais, N., Mangelinck, D.

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 2.04 MB

english, 2013

36

Author Index

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 162 KB

english, 2013

37

Organic bistable memory device from natural rubber (cis 1,4 polyisoprene)/fullerene nanocomposite thin films

Predeep, P., Devasia, Dinumol, Aneesh, J., Faseena, N.M.

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 992 KB

english, 2013

38

Impact of high density TSVs on the assembly of 3D-ICs packaging

Lee, C.C., Yang, T.F., Wu, C.S., Kao, K.S., Fang, C.W., Zhan, C.J., Lau, J.H., Chen, T.H.

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 2.09 MB

english, 2013

39

Inside Front Cover - Editorial Board

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 29 KB

english, 2013

40

Copper pillar interconnect capability for mmwave applications in 3D integration technology

Joblot, S., Bar, P., Sibuet, H., Ferrandon, C., Reig, B., Jan, S., Arnaud, C., Lamy, Y., Coudrain, P., Coffy, R., Boillon, O., Carpentier, J.F.

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 2.72 MB

english, 2013

41

Effects of moisture absorption on anisotropic conductive films interconnection for flip chip on flex applications

Yin, C.Y., Lu, H., Bailey, C., Chan, Y.C.

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 1.73 MB

english, 2013

42

Modeling and simulation of the interplay between contact metallization and stress liner technologies for strained silicon

Schuster, J., Schulz, S.E., Herrmann, T., Richter, R.

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 1015 KB

english, 2013

43

The characteristics of Cu nanopaste sintered by atmospheric-pressure plasma

Kim, Kwang-Seok, Bang, Jae-Oh, Choa, Yong-Ho, Jung, Seung-Boo

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 1.48 MB

english, 2013

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