Local damage free Si substrate ultra thinning for backside emission spectral analysis using OBPF for LSI failure mode detection
Noae, Takuya, Ikeuchi, Tamao, Moritni, Chie, Endoh, Hirohiko, Yokoyama, KohichiVolume:
53
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2013.05.013
Date:
December, 2013
File:
PDF, 3.13 MB
english, 2013