Electrical and Reliability Investigation of Cu TSVs With...

IEEE Electron Device Letters 2013 / 01 Vol. 34; Iss. 1

Electrical and Reliability Investigation of Cu TSVs With Low-Temperature Cu/Sn and BCB Hybrid Bond Scheme

Chang, Yao-Jen, Ko, Cheng-Ta, Chen, Kuan-Neng
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Volume:
34
Language:
english
Journal:
IEEE Electron Device Letters
DOI:
10.1109/LED.2012.2225136
Date:
January, 2013
File:
PDF, 396 KB
english, 2013
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