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Through-wafer copper electroplating for three-dimensional interconnects
Nguyen, N T, Boellaard, E, Pham, N P, Kutchoukov, V G, Craciun, G, Sarro, P MVolume:
12
Language:
english
Journal:
Journal of Micromechanics and Microengineering
DOI:
10.1088/0960-1317/12/4/308
Date:
July, 2002
File:
PDF, 1.07 MB
english, 2002