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Repairing bonding wire connections using a microsoldering unit inside an SEM
Rummel, Andreas, Schock, Klaus, Kemmler, Matthias, Smith, Andrew, Kleindiek, StephanVolume:
53
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2013.07.116
Date:
September, 2013
File:
PDF, 1.73 MB
english, 2013