Reaction of solder with Ni/Au metallization for electronic...

IEEE Transactions on Advanced Packaging 2001 / Nov. Vol. 24; Iss. 2

Reaction of solder with Ni/Au metallization for electronic packages during reflow soldering

Ho, C.E., Tsai, S.Y., Kao, C.R.
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Volume:
24
Language:
english
Journal:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/6040.982835
Date:
January, 2001
File:
PDF, 166 KB
english, 2001
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