WIAD Minimization in Butterfly Laser Module Packages: Clip...

IEEE Transactions on Advanced Packaging 2007 / 08 Vol. 30; Iss. 3

WIAD Minimization in Butterfly Laser Module Packages: Clip Design

Lin, Yaomin, Guo, Jingyan, Shapiro, Andrew A., Shi, Frank G.
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Volume:
30
Language:
english
Journal:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/tadvp.2007.901528
Date:
August, 2007
File:
PDF, 1.34 MB
english, 2007
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