Volume 30; Issue 3

IEEE Transactions on Advanced Packaging

Volume 30; Issue 3

1

A Fully Embedded LTCC Multilayer BPF for 3-D Integration of 40-GHz Radio

Yun Hee Cho, Dong Yun Jung, Young Chul Lee, Lee, J.W., Myung Sun Song, Eun-Soo Nam, Sukhoon Kang, Chul Soon Park

Journal:

IEEE Transactions on Advanced Packaging

Year:

2007

Language:

english

File:

PDF, 1.14 MB

english, 2007

2

Multidisciplinary Electronic Package Design and Optimization Methodology Based on Genetic Algorithm

Suwa, T., Hadim, H.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2007

Language:

english

File:

PDF, 992 KB

english, 2007

3

High-Temperature Operation of SiC Power Devices by Low-Temperature Sintered Silver Die-Attachment

Bai, John Guofeng, Yin, Jian, Zhang, Zhiye, Lu, Guo-Quan, van Wyk, Jacobus Daniel

Journal:

IEEE Transactions on Advanced Packaging

Year:

2007

Language:

english

File:

PDF, 1.15 MB

english, 2007

4

Numerical Study of Gold Wire Bonding Process on Cu/Low-k Structures

Viswanath, Akella G. K., Zhang, Xiaowu, Ganesh, V. P., Chun, Lu

Journal:

IEEE Transactions on Advanced Packaging

Year:

2007

Language:

english

File:

PDF, 1.55 MB

english, 2007

5

A Microjet Array Cooling System for Thermal Management of High-Brightness LEDs

Luo, Xiaobing, Liu, Sheng

Journal:

IEEE Transactions on Advanced Packaging

Year:

2007

Language:

english

File:

PDF, 1.22 MB

english, 2007

6

Experimental Analysis of the Water Absorption Effects on RF/mm-Wave Active/Passive Circuits Packaged in Multilayer Organic Substrates

Thompson, Dane C., Tentzeris, Manos M., Papapolymerou, John

Journal:

IEEE Transactions on Advanced Packaging

Year:

2007

Language:

english

File:

PDF, 838 KB

english, 2007

7

Preparation of Fine Copper Powder With Chemical Reduction Method and Its Application in MLCC

Journal:

IEEE Transactions on Advanced Packaging

Year:

2007

Language:

english

File:

PDF, 1.73 MB

english, 2007

8

WIAD Minimization in Butterfly Laser Module Packages: Clip Design

Lin, Yaomin, Guo, Jingyan, Shapiro, Andrew A., Shi, Frank G.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2007

Language:

english

File:

PDF, 1.34 MB

english, 2007

9

Electron Attachment: A New Approach to ${\rm H} _{2}$ Fluxless Solder Reflow for Wafer Bumping

Dong, C. Christine, Patrick, Richard E., Karwacki, Eugene J.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2007

Language:

english

File:

PDF, 2.48 MB

english, 2007

10

A Study on Dielectric Constants of ${\rm Epoxy/SrTiO}_{3}$ Composite for Embedded Capacitor Films (ECFs)

Lee, Sangyong, Hyun, Jin-Gul, Kim, Hyungsoo, Paik, Kyung-Wook

Journal:

IEEE Transactions on Advanced Packaging

Year:

2007

Language:

english

File:

PDF, 2.07 MB

english, 2007

11

Fabrication of Application Specific Integrated Passive Devices Using Wafer Level Packaging Technologies

Zoschke, Kai, Wolf, M. JÜrgen, Topper, Michael, Ehrmann, Oswin, Fritzsch, Thomas, Kaletta, Katrin, Schmuckle, Franz-Josef, Reichl, Herbert

Journal:

IEEE Transactions on Advanced Packaging

Year:

2007

Language:

english

File:

PDF, 2.18 MB

english, 2007

12

Viscoelastic Effect of FR-4 Material on Packaging Stress Development

Journal:

IEEE Transactions on Advanced Packaging

Year:

2007

Language:

english

File:

PDF, 613 KB

english, 2007

13

A Novel Test Strategy for Fine Pitch Wafer-Level Packaged Devices

Jayabalan, Jayasanker, Rotaru, Mihai Dragos, Rao, Vempati Srinivasa, Kripesh, Vaidyanathan, Iyer, Mahadevan Krishna, Tay, Andrew A. O., Ooi, Ban-Leong, Leong, Mook-Seng

Journal:

IEEE Transactions on Advanced Packaging

Year:

2007

Language:

english

File:

PDF, 2.71 MB

english, 2007

14

Measurement of Moisture-Induced Packaging Stress With Piezoresistive Sensors

Lwo, Ben-Je, Lin, Chih-Shiang

Journal:

IEEE Transactions on Advanced Packaging

Year:

2007

Language:

english

File:

PDF, 1.85 MB

english, 2007

15

Towards a Thermal Moore's Law

Krishnan, Shankar, Garimella, Suresh V., Chrysler, Gregory M., Mahajan, Ravi V.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2007

Language:

english

File:

PDF, 921 KB

english, 2007

16

-Polyacrylate/Silica Nanocomposite Resin

Wang, Yu-Young, Hsieh, Tsung-Eong, Chen, I-Ching, Chen, Chin-Hsin

Journal:

IEEE Transactions on Advanced Packaging

Year:

2007

Language:

english

File:

PDF, 1.84 MB

english, 2007

17

Multichip Integration on a PLC Platform for 16$\,\times\,$16 Optical Switch Module Using Passive Alignment Technique

Rho, Byung Sup, Lim, Jung Woon

Journal:

IEEE Transactions on Advanced Packaging

Year:

2007

Language:

english

File:

PDF, 1.03 MB

english, 2007

18

Behavior of Short Pulses on Tightly Coupled Microstrip Lines and Reduction of Crosstalk by Using Overlying Dielectric

Muthana, Prathap, Kroger, Harry

Journal:

IEEE Transactions on Advanced Packaging

Year:

2007

Language:

english

File:

PDF, 1.18 MB

english, 2007

19

Integration of 0/1-Level Packaged RF-MEMS Devices on MCM-D at Millimeter-Wave Frequencies

Carchon, Geert J., Jourdain, Anne, Vendier, Olivier, Schoebel, Joerg, Tilmans, Harrie A. C.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2007

Language:

english

File:

PDF, 1.39 MB

english, 2007

20

Characterization of Co-Planar Silicon Transmission Lines With and Without Slow-Wave Effect

Kim, Woopoung, Swaminathan, Madhavan

Journal:

IEEE Transactions on Advanced Packaging

Year:

2007

Language:

english

File:

PDF, 746 KB

english, 2007

21

Algorithmic Approach for Thermal Port Definition

Celo, Dritan, Walkey, David J., Smy, Tom

Journal:

IEEE Transactions on Advanced Packaging

Year:

2007

Language:

english

File:

PDF, 625 KB

english, 2007

22

Metal–Polymer Composite Interconnections for Ultra Fine-Pitch Wafer Level Packaging

Aggarwal, Ankur O., Raj, P. Markondeya, Tummala, Rao R.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2007

Language:

english

File:

PDF, 6.34 MB

english, 2007

23

Embedded Passives on Large Panel Multilayer Liquid Crystalline Polymer-Based Substrate

Yun, Wansuk, Sundaram, Venky, Swaminathan, Madhavan

Journal:

IEEE Transactions on Advanced Packaging

Year:

2007

Language:

english

File:

PDF, 2.08 MB

english, 2007

24

A Novel Design Structure for WLCSP With High Reliability, Low Cost, and Ease of Fabrication

Chang, Shu-Ming, Cheng, Chih-Yuan, Shen, Li-Cheng, Chiang, Kuo-Ning, Hwang, Yu-Jiau, Chen, Yu-Fang, Ko, Cheng-Ta, Chen, Kuo-Chyuan

Journal:

IEEE Transactions on Advanced Packaging

Year:

2007

Language:

english

File:

PDF, 1.10 MB

english, 2007

25

Fundamental Building Blocks for Circuits on Textiles

Locher, I., Troster, G.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2007

Language:

english

File:

PDF, 3.65 MB

english, 2007

26

An Integrated Signal and Power Integrity Analysis for Signal Traces Through the Parallel Planes Using Hybrid Finite-Element and Finite-Difference Time-Domain Techniques

Guo, Wei-Da, Shiue, Guang-Hwa, Lin, Chien-Min, Wu, Ruey-Beei

Journal:

IEEE Transactions on Advanced Packaging

Year:

2007

Language:

english

File:

PDF, 1.66 MB

english, 2007

27

Design and Fabrication of Ultra-Wideband Baluns Embedded in Multilayer Liquid Crystal Polymer Flex

Chen, Andy C., Chen, Morgan J., Pham, Anh-Vu

Journal:

IEEE Transactions on Advanced Packaging

Year:

2007

Language:

english

File:

PDF, 2.02 MB

english, 2007

28

-Band LTCC Applications

Lee, Young Chul, Park, Chul Soon

Journal:

IEEE Transactions on Advanced Packaging

Year:

2007

Language:

english

File:

PDF, 655 KB

english, 2007

29

Dramatic Improvements in the Matrix Solution Time for Method of Moment Problems Involving Stripline Interconnects

Wang, Xing, Zhu, Zhaohui, Cao, Yi, Dvorak, Steven L., Prince, John L.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2007

Language:

english

File:

PDF, 1.88 MB

english, 2007

30

Foreword Wafer-Level Packaging

van Driel, Willem Dirk

Journal:

IEEE Transactions on Advanced Packaging

Year:

2007

Language:

english

File:

PDF, 195 KB

english, 2007