Analytical modeling of multi-layered Printed Circuit Board dedicated to electronic component thermal characterization
Monier-Vinard, Eric, Laraqi, Najib, Dia, Cheikh-Tidiane, Nguyen, Minh-Nhat, Bissuel, ValentinVolume:
103
Language:
english
Journal:
Solid-State Electronics
DOI:
10.1016/j.sse.2014.09.004
Date:
January, 2015
File:
PDF, 700 KB
english, 2015