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Understanding the strength of epoxy-polyimide interfaces for flip-chip packages
Hoontrakul, P., Sperling, L.H., Pearson, R.A.Volume:
3
Language:
english
Journal:
IEEE Transactions on Device and Materials Reliability
DOI:
10.1109/tdmr.2003.821543
Date:
December, 2003
File:
PDF, 635 KB
english, 2003