Volume 3; Issue 4

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IEEE Transactions on Device and Materials Reliability
Volume 3; Issue 4

IEEE Transactions on Device and Materials Reliability

Volume 3; Issue 4

1

The prediction of stiction failures in MEMS

van Spengen, W.M., Puers, R., De Wolf, I.

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2003

Language:

english

File:

PDF, 342 KB

english, 2003

2

Lifetime prediction and design of reliability tests for high-power devices in automotive applications

Ciappa, M., Carbognani, F., Fichtner, W.

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2003

Language:

english

File:

PDF, 351 KB

english, 2003

3

Vapor phase anti-stiction coatings for MEMS

Ashurst, W.R., Carraro, C., Maboudian, R.

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2003

Language:

english

File:

PDF, 311 KB

english, 2003

4

Understanding the strength of epoxy-polyimide interfaces for flip-chip packages

Hoontrakul, P., Sperling, L.H., Pearson, R.A.

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2003

Language:

english

File:

PDF, 635 KB

english, 2003

5

Thermomechanical analysis of gold-based SiC die-attach assembly

Meyyappan, K., McCluskey, P., LiangYu Chen,

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2003

Language:

english

File:

PDF, 1.04 MB

english, 2003

6

Investigation of interfaces with analytical tools

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2003

Language:

english

File:

PDF, 639 KB

english, 2003

7

Highly accelerated electromigration lifetime test (HALT) of copper

Aubel, O., Hasse, W., Hommel, M.

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2003

Language:

english

File:

PDF, 512 KB

english, 2003

8

Mechanics of interface fracture with applications in electronic packaging

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2003

Language:

english

File:

PDF, 1.27 MB

english, 2003

9

A study of delamination growth in the die-attach layer of plastic IC packages under hygrothermal loading during solder reflow

Tay, A.A.O., Goh, K.Y.

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2003

Language:

english

File:

PDF, 589 KB

english, 2003

10

Thermal distribution during destructive pulses in ESD protection devices using a single-shot two-dimensional interferometric method

Pogany, D., Bychikhin, S., Kuzmik, J., Dubec, V., Jensen, N., Denison, M., Groos, G., Stecher, M., Gornik, E.

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2003

Language:

english

File:

PDF, 758 KB

english, 2003

11

Packaging effects on reliability of cu/low-k interconnects

Guotao Wang,, Merrill, C., Jie-Hua Zhao,, Groothuis, S.K., Ho, P.S.

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2003

Language:

english

File:

PDF, 7.51 MB

english, 2003

12

Board level solder reliability versus ramp rate and dwell time during temperature cycling

Zhai, C.J., Sidharth,, Blish, R.

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2003

Language:

english

File:

PDF, 1.88 MB

english, 2003

13

Recovery of shifted MOS parameters induced by focused ion beam exposure

Kaiyuan Chen,, Chatterjee, T., Parker, J., Henderson, T., San Martin, R., Edwards, H.

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2003

Language:

english

File:

PDF, 303 KB

english, 2003

14

Reliability prediction modeling of semiconductor light emitting device

Jingsong Xie,, Pecht, M.

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2003

Language:

english

File:

PDF, 317 KB

english, 2003

15

Analysis of flip-chip packaging challenges on copper/low-k interconnects

Mercado, L.L., Goldberg, C., Shun-Meen Kuo,, Tien-Yu Lee,, Pozder, S.K.

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2003

Language:

english

File:

PDF, 1.55 MB

english, 2003

16

AMLCD flicker model considering the V/sub T/ shift in a-Si:H TFT

Chung-Che Huang,, Constable, J.H., Yost, B., Greene, R.G.

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2003

Language:

english

File:

PDF, 1.11 MB

english, 2003

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