Thermomechanical analysis of gold-based SiC die-attach...

IEEE Transactions on Device and Materials Reliability 2003 / 12 Vol. 3; Iss. 4

Thermomechanical analysis of gold-based SiC die-attach assembly

Meyyappan, K., McCluskey, P., LiangYu Chen,
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Volume:
3
Language:
english
Journal:
IEEE Transactions on Device and Materials Reliability
DOI:
10.1109/tdmr.2003.821538
Date:
December, 2003
File:
PDF, 1.04 MB
english, 2003
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