Chip-level soft error estimation method
Nguyen, H.T., Yagil, Y., Seifert, N., Reitsma, M.Volume:
5
Language:
english
Journal:
IEEE Transactions on Device and Materials Reliability
DOI:
10.1109/tdmr.2005.858334
Date:
September, 2005
File:
PDF, 556 KB
english, 2005