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Interval optimal design of 3-D TSV stacked chips package reliability by using the genetic algorithm method
Cheng, Hsin-En, Chen, Rong-ShengVolume:
54
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2014.08.018
Date:
December, 2014
File:
PDF, 6.41 MB
english, 2014