Mechanics of interface fracture with applications in...

Mechanics of interface fracture with applications in electronic packaging

Nied, H.F.
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Volume:
3
Language:
english
Journal:
IEEE Transactions on Device and Materials Reliability
DOI:
10.1109/tdmr.2003.820623
Date:
December, 2003
File:
PDF, 1.27 MB
english, 2003
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