A study of delamination growth in the die-attach layer of...

IEEE Transactions on Device and Materials Reliability 2003 / 12 Vol. 3; Iss. 4

A study of delamination growth in the die-attach layer of plastic IC packages under hygrothermal loading during solder reflow

Tay, A.A.O., Goh, K.Y.
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Volume:
3
Language:
english
Journal:
IEEE Transactions on Device and Materials Reliability
DOI:
10.1109/tdmr.2003.820793
Date:
December, 2003
File:
PDF, 589 KB
english, 2003
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