Underfill viscous flow between parallel plates and solder...

IEEE Transactions on Components and Packaging Technologies 2002 / 12 Vol. 25; Iss. 4

Underfill viscous flow between parallel plates and solder bumps

Wen-Bin Young,, Wen-Lin Yang,
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Volume:
25
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/tcapt.2002.806176
Date:
December, 2002
File:
PDF, 510 KB
english, 2002
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