Volume 25; Issue 4

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IEEE Transactions on Components and Packaging Technologies
Volume 25; Issue 4

IEEE Transactions on Components and Packaging Technologies

Volume 25; Issue 4

1

Development of silver zinc oxide for general-purpose relays

Schoepf, T.J., Behrens, V., Honig, T., Kraus, A.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2002

Language:

english

File:

PDF, 1.79 MB

english, 2002

2

Dynamically inserting, operating, and eliminating thermal sensors of FPGA-based systems

Lopez-Buedo, S., Garrido, J., Boemo, E.I.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2002

Language:

english

File:

PDF, 523 KB

english, 2002

3

Wire bonding to advanced copper, low-K integrated circuits, the metal/dielectric stacks, and materials considerations

Harman, G.G., Johnson, C.E.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2002

Language:

english

File:

PDF, 751 KB

english, 2002

4

Enhanced electronic system reliability - challenges for temperature prediction

Parry, J.D., Rantala, J., Lasance, C.J.M.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2002

Language:

english

File:

PDF, 514 KB

english, 2002

5

Thermal issues in MEMS and microscale systems

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2002

Language:

english

File:

PDF, 900 KB

english, 2002

6

Design and optimization of air-cooled heat sinks for sustainable development

Bar-Cohen, A., Iyengar, M.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2002

Language:

english

File:

PDF, 875 KB

english, 2002

7

Effect of connection design on the contact resistance of high power overlapping bolted joints

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2002

Language:

english

File:

PDF, 514 KB

english, 2002

8

Design and performance evaluation of a compact thermosyphon

Pal, A., Joshi, Y.K., Beitelmal, M.H., Patel, C.D., Wenger, T.M.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2002

Language:

english

File:

PDF, 555 KB

english, 2002

9

Advanced thermal architecture for cooling of high power electronics

Zhijun Zuo,, Hoover, L.R., Phillips, A.L.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2002

Language:

english

File:

PDF, 1.27 MB

english, 2002

10

Thermal challenges in next generation electronic systems - summary of panel presentations and discussions

Garimella, S.V., Joshi, Y.K., Bar-Cohen, A., Mahajan, R., Toh, K.C., Carey, V.P., Baelmans, M., Lohan, J., Sammakia, B., Andros, F.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2002

Language:

english

File:

PDF, 518 KB

english, 2002

11

Underfill viscous flow between parallel plates and solder bumps

Wen-Bin Young,, Wen-Lin Yang,

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2002

Language:

english

File:

PDF, 510 KB

english, 2002

12

In-plane effective thermal conductivity of plain-weave screen laminates

Jun Xu,, Wirtz, R.A.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2002

Language:

english

File:

PDF, 507 KB

english, 2002

13

Transition from the anodic arc phase to the cathodic metallic arc phase in vacuum at low DC electrical level

Jemaa, N.B., Morin, L.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2002

Language:

english

File:

PDF, 609 KB

english, 2002

14

An investigation of the sensitivity of embedded passive component temperatures to PCB structure

Stubbs, D.M., Pulko, S.H., Wilkinson, A.J.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2002

Language:

english

File:

PDF, 570 KB

english, 2002

15

Dynamics and topology optimization of piezoelectric fans

Burmann, P., Raman, A., Garimella, S.V.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2002

Language:

english

File:

PDF, 1.63 MB

english, 2002

16

Measuring partial thermal resistances in a heat-flow path

Rencz, M.R., Szekely, V.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2002

Language:

english

File:

PDF, 603 KB

english, 2002

17

Transient two-dimensional heat conduction analysis of electronic packages by coupled boundary and finite element methods

Guven, I., Madenci, E., Cho Lik Chan,

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2002

Language:

english

File:

PDF, 817 KB

english, 2002

18

The role of water in delamination in electronics packages: water evaporation from epoxy

Lam, D.C.C., Chong, J.I.T., Pin Tong,

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2002

Language:

english

File:

PDF, 392 KB

english, 2002

19

Performance characterization of a novel flat plate micro heat pipe spreader

Kalahasti, S., Joshi, Y.K.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2002

Language:

english

File:

PDF, 936 KB

english, 2002

20

Warpage measurement comparison using shadow Moire and projection Moire methods

Hai Ding,, Powell, R.E., Hanna, C.R., Ume, I.C.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2002

Language:

english

File:

PDF, 824 KB

english, 2002

21

Increasing the accuracy of thermal transient measurements

Szekely, V., Rencz, M.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2002

Language:

english

File:

PDF, 491 KB

english, 2002

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