Through-Strata-Via (TSV) Parasitics and Wideband Modeling...

IEEE Electron Device Letters 2011 / 09 Vol. 32; Iss. 9

Through-Strata-Via (TSV) Parasitics and Wideband Modeling for Three-Dimensional Integration/Packaging

Xu, Zheng, Lu, Jian-Qiang
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Volume:
32
Language:
english
Journal:
IEEE Electron Device Letters
DOI:
10.1109/led.2011.2158511
Date:
September, 2011
File:
PDF, 283 KB
english, 2011
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