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Warpage Measurement of Board Assemblies Using Projection MoirÉ System With Improved Automatic Image Segmentation Algorithm
Tan, Wei, Ume, I. CharlesVolume:
31
Language:
english
Journal:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/tadvp.2008.927855
Date:
August, 2008
File:
PDF, 1.04 MB
english, 2008