Warpage Measurement of Board Assemblies Using Projection...

IEEE Transactions on Advanced Packaging 2008 / 08 Vol. 31; Iss. 3

Warpage Measurement of Board Assemblies Using Projection MoirÉ System With Improved Automatic Image Segmentation Algorithm

Tan, Wei, Ume, I. Charles
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Volume:
31
Language:
english
Journal:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/tadvp.2008.927855
Date:
August, 2008
File:
PDF, 1.04 MB
english, 2008
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