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Low-cycle fatigue failure behavior and life evaluation of lead-free solder joint under high temperature
Zhu, Yongxin, Li, Xiaoyan, Gao, Ruiting, Wang, ChaoVolume:
54
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2014.08.016
Date:
December, 2014
File:
PDF, 2.50 MB
english, 2014