![](/img/cover-not-exists.png)
Modeling and simulation of power electronic modules with microchannel coolers for thermo-mechanical performance
Xu, Ling, Liu, Yong, Liu, ShengVolume:
54
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2014.07.053
Date:
December, 2014
File:
PDF, 4.44 MB
english, 2014