Impact of dielectric stack and interface adhesion on...

Microelectronic Engineering 2005 Vol. 82; Iss. 3-4

Impact of dielectric stack and interface adhesion on mechanical properties of porous ultra low-k

Julien Vitiello, Arno Fuchsmann, Laurent-Luc Chapelon, Vincent Arnal, Daniel Barbier, Joaquin Torres
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Volume:
82
Year:
2005
Language:
english
Pages:
5
DOI:
10.1016/j.mee.2005.07.026
File:
PDF, 163 KB
english, 2005
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