High-temperature wire sweep characteristics of...

High-temperature wire sweep characteristics of semiconductor package for variable loop-height wirebonding technology

Huang-Kuang Kung, Bo-Wun Huang
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Volume:
83
Year:
2006
Language:
english
Pages:
9
DOI:
10.1016/j.mee.2005.08.005
File:
PDF, 289 KB
english, 2006
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