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Erratum to: “Temperature effects of pad conditioning process on oxide CMP: Polishing pad, slurry characteristics, and surface reactions” [Microelect. Eng. 83 (2006) 362–370]
Nam-Hoon Kim, Yong-Jin Seo, Woo-Sun LeeVolume:
84
Year:
2007
Language:
english
DOI:
10.1016/j.mee.2007.02.002
File:
PDF, 251 KB
english, 2007