Thermal characteristic of Cu–Cu bonding layer in 3-D...

Thermal characteristic of Cu–Cu bonding layer in 3-D integrated circuits stack

Chuan Seng Tan
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Volume:
87
Year:
2010
Language:
english
Pages:
4
DOI:
10.1016/j.mee.2009.09.009
File:
PDF, 277 KB
english, 2010
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