Electromigration behavior of dual-damascene Cu...

Microelectronics Reliability 2004 Vol. 44; Iss. 5

Electromigration behavior of dual-damascene Cu interconnects––Structure, width, and length dependences

A.V Vairagar, S.G Mhaisalkar, Ahila Krishnamoorthy
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Volume:
44
Year:
2004
Language:
english
Pages:
8
DOI:
10.1016/j.microrel.2003.12.011
File:
PDF, 498 KB
english, 2004
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