Volume 44; Issue 5

Microelectronics Reliability

Volume 44; Issue 5

1

Effect of microwave preheating on the bonding performance of flip chip on flex joint

R.A. Islam, Y.C. Chan

Journal:

Microelectronics Reliability

Year:

2004

Language:

english

File:

PDF, 391 KB

english, 2004

2

Statistical analysis for test lands positioning and PCB deformation during electrical testing

L. Han, A. Voloshin

Journal:

Microelectronics Reliability

Year:

2004

Language:

english

File:

PDF, 501 KB

english, 2004

3

Electromigration behavior of dual-damascene Cu interconnects––Structure, width, and length dependences

A.V Vairagar, S.G Mhaisalkar, Ahila Krishnamoorthy

Journal:

Microelectronics Reliability

Year:

2004

Language:

english

File:

PDF, 498 KB

english, 2004

4

A power-constrained design strategy for CMOS tuned low noise amplifiers

O. Mitrea, M. Glesner

Journal:

Microelectronics Reliability

Year:

2004

Language:

english

File:

PDF, 377 KB

english, 2004

5

Reliability issues for flip-chip packages

Paul S. Ho, Guotao Wang, Min Ding, Jie-Hua Zhao, Xiang Dai

Journal:

Microelectronics Reliability

Year:

2004

Language:

english

File:

PDF, 1.65 MB

english, 2004

6

Thermal design and experimental validation for optical transmitters

Peter Z.F. Shi, Albert C.W. Lu, Y.M. Tan, Stephen C.K. Wong, Eric Tan, Ronson Tan

Journal:

Microelectronics Reliability

Year:

2004

Language:

english

File:

PDF, 890 KB

english, 2004

7

Mechanical loading of flip chip joints before underfill: the impact on yield and reliability

Journal:

Microelectronics Reliability

Year:

2004

Language:

english

File:

PDF, 500 KB

english, 2004

8

Extraction of bonding strain data in diode lasers from polarization-resolved photoluminescence measurements

Mark A. Fritz, Daniel T. Cassidy

Journal:

Microelectronics Reliability

Year:

2004

Language:

english

File:

PDF, 469 KB

english, 2004

9

An example of fault site localization on a 0.18 μm CMOS device with combination of front and backside techniques

Yoshiteru Yamada, Hirotaka Komoda

Journal:

Microelectronics Reliability

Year:

2004

Language:

english

File:

PDF, 510 KB

english, 2004

10

Conduction mechanisms in MOS gate dielectric films

B.L. Yang, P.T. Lai, H. Wong

Journal:

Microelectronics Reliability

Year:

2004

Language:

english

File:

PDF, 474 KB

english, 2004

11

Digitally programmable CMOS transconductor for very high frequency

Aránzazu Otı́n, Santiago Celma, Concepción Aldea

Journal:

Microelectronics Reliability

Year:

2004

Language:

english

File:

PDF, 604 KB

english, 2004

12

Technical challenges of stencil printing technology for ultra fine pitch flip chip bumping

Dionysios Manessis, Rainer Patzelt, Andreas Ostmann, Rolf Aschenbrenner, Herbert Reichl

Journal:

Microelectronics Reliability

Year:

2004

Language:

english

File:

PDF, 426 KB

english, 2004

13

Investigation on bondability and reliability of UV-curable adhesive joints for stable mechanical properties in photonic device packaging

C.W. Tan, Y.C. Chan, H.P. Chan, N.W. Leung, C.K. So

Journal:

Microelectronics Reliability

Year:

2004

Language:

english

File:

PDF, 643 KB

english, 2004

14

A testing method for assessing solder joint reliability of FCBGA packages

Jinlin Wang, H.K. Lim, H.S. Lew, Woon Theng Saw, Chew Hong Tan

Journal:

Microelectronics Reliability

Year:

2004

Language:

english

File:

PDF, 676 KB

english, 2004

15

Investigation of long-term reliability and failure mechanism of solder interconnections with multifunctional micro-moiré interferometry system

X.Q. Shi, H.L.J. Pang, X.R. Zhang

Journal:

Microelectronics Reliability

Year:

2004

Language:

english

File:

PDF, 795 KB

english, 2004

16

On the reliability of ZrO2 films for VLSI applications

Domenico Caputo, Fernanda Irrera

Journal:

Microelectronics Reliability

Year:

2004

Language:

english

File:

PDF, 321 KB

english, 2004

17

Study on thermomechanical reliability of a tunable light modulator

Zhimin Mo, Helge Kristiansen, Morten Eliassen, Shiming Li, Johan Liu

Journal:

Microelectronics Reliability

Year:

2004

Language:

english

File:

PDF, 426 KB

english, 2004

18

A/D converter based on a new memory cell implemented using the switched current technique

Paweł Śniatała, André S. Botha

Journal:

Microelectronics Reliability

Year:

2004

Language:

english

File:

PDF, 388 KB

english, 2004

19

Photo-CVD process for ultra thin SiO2 films

V. Sánchez, J. Munguı́a, M. Estrada

Journal:

Microelectronics Reliability

Year:

2004

Language:

english

File:

PDF, 280 KB

english, 2004

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