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Response surface models for efficient, modular estimation of solder joint reliability in area array packages
L. Zhang, G. Subbarayan, B.C. Hunter, D. RoseVolume:
45
Year:
2005
Language:
english
Pages:
13
DOI:
10.1016/j.microrel.2004.06.007
File:
PDF, 418 KB
english, 2005