Volume 45; Issue 3-4

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Microelectronics Reliability
Volume 45; Issue 3-4

Microelectronics Reliability

Volume 45; Issue 3-4

1

Response surface models for efficient, modular estimation of solder joint reliability in area array packages

L. Zhang, G. Subbarayan, B.C. Hunter, D. Rose

Journal:

Microelectronics Reliability

Year:

2005

Language:

english

File:

PDF, 418 KB

english, 2005

2

A mid-value select voter

M.D. Krstic, M.K. Stojcev, G. Lj. Djordjevic, I.D. Andrejic

Journal:

Microelectronics Reliability

Year:

2005

Language:

english

File:

PDF, 289 KB

english, 2005

3

A study of post-etch wet clean on electrical and reliability performance of Cu/low k interconnections

C.F. Tsang, C.K. Chang, A. Krishnamoorthy, K.Y. Ee, Y.J. Su, H.Y. Li, W.H. Li, L.Y. Wong

Journal:

Microelectronics Reliability

Year:

2005

Language:

english

File:

PDF, 666 KB

english, 2005

4

Processing quality results for electroless/electroplating of high-aspect ratio plated through holes in industrially produced printed circuit boards

Sam Siau, Johan De Baets, Andre Van Calster, Leon Heremans, Sammy Tanghe

Journal:

Microelectronics Reliability

Year:

2005

Language:

english

File:

PDF, 1007 KB

english, 2005

5

Theoretical investigation on hermeticity testing of MEMS packages based on MIL-STD-883E

Yi Tao, Ajay P. Malshe

Journal:

Microelectronics Reliability

Year:

2005

Language:

english

File:

PDF, 159 KB

english, 2005

6

Ultra-thin high-density LSI packaging substrate for advanced CSPs and SiPs

Tadanori Shimoto, Kazuhiro Baba, Koji Matsui, Jun Tsukano, Takehiko Maeda, Kenji Oyachi

Journal:

Microelectronics Reliability

Year:

2005

Language:

english

File:

PDF, 469 KB

english, 2005

7

Electrothermal characterization of silicon-on-glass VDMOSFETs

N. Nenadović, V. Cuoco, S.J.C.H. Theeuwen, L.K. Nanver, H. Schellevis, G. Spierings, H.F.F. Jos, J.W. Slotboom

Journal:

Microelectronics Reliability

Year:

2005

Language:

english

File:

PDF, 410 KB

english, 2005

8

Evaluation of electrolessly deposited NiP integral resistors on flexible polyimide substrate

Tuomas F. Waris, Markus P.K. Turunen, Tomi Laurila, Jorma K. Kivilahti

Journal:

Microelectronics Reliability

Year:

2005

Language:

english

File:

PDF, 475 KB

english, 2005

9

Impact of wafer charging on hot carrier reliability and optimization of latent damage detection methodology in advanced CMOS technologies

D. Goguenheim, A. Bravaix, S. Gomri, J.M. Moragues, C. Monserie, N. Legrand, P. Boivin

Journal:

Microelectronics Reliability

Year:

2005

Language:

english

File:

PDF, 481 KB

english, 2005

10

Modeling, simulation and temperature compensation of porous polysilicon capacitive humidity sensor using ANN technique

T. Islam, C. Pramanik, H. Saha

Journal:

Microelectronics Reliability

Year:

2005

Language:

english

File:

PDF, 372 KB

english, 2005

11

Study of anisotropic conductive adhesive joint behavior under 3-point bending

M.J. Rizvi, Y.C. Chan, C. Bailey, H. Lu

Journal:

Microelectronics Reliability

Year:

2005

Language:

english

File:

PDF, 379 KB

english, 2005

12

Intermediate wafer level bonding and interface behavior

C.T. Pan, P.J. Cheng, M.F. Chen, C.K. Yen

Journal:

Microelectronics Reliability

Year:

2005

Language:

english

File:

PDF, 376 KB

english, 2005

13

Evaluation of parasitic capacitances for interconnection buses crossing in different layers

A. Jarosz, A. Pfitzner

Journal:

Microelectronics Reliability

Year:

2005

Language:

english

File:

PDF, 241 KB

english, 2005

14

Systematic evaluation of thermal interface materials—a case study in high power amplifier design

Luke Maguire, Masud Behnia, Graham Morrison

Journal:

Microelectronics Reliability

Year:

2005

Language:

english

File:

PDF, 604 KB

english, 2005

15

A new method for the lifetime determination of submicron metal interconnects by means of a parallel test structure

K. Vanstreels, M. D’Olieslaeger, W. De Ceuninck, J. D’Haen, K. Maex

Journal:

Microelectronics Reliability

Year:

2005

Language:

english

File:

PDF, 231 KB

english, 2005

16

Hybrid reliability assessment for packaging prototyping

Hua Lu, Jesse Zhou, Rich Golek, Ming Zhou

Journal:

Microelectronics Reliability

Year:

2005

Language:

english

File:

PDF, 752 KB

english, 2005

17

SiLK™ etch optimization and electrical characterization for 0.13 μm interconnects

Ramana Murthy, Y.W. Chen, A. Krishnamoorthy, X.T. Chen

Journal:

Microelectronics Reliability

Year:

2005

Language:

english

File:

PDF, 985 KB

english, 2005

18

100 μm Pitch flip chip on foil assemblies with adhesive interconnections

J. de Vries, J. van Delft, C. Slob

Journal:

Microelectronics Reliability

Year:

2005

Language:

english

File:

PDF, 519 KB

english, 2005

19

Characterization of bump arrays at RF/microwave frequencies

Ivan N. Ndip, Grit Sommer, Werner John, Herbert Reichl

Journal:

Microelectronics Reliability

Year:

2005

Language:

english

File:

PDF, 522 KB

english, 2005

20

Low voltage SILC and P- and N-MOSFET gate oxide reliability

C. Petit, A. Meinertzhagen, D. Zander, O. Simonetti, M. Fadlallah, T. Maurel

Journal:

Microelectronics Reliability

Year:

2005

Language:

english

File:

PDF, 438 KB

english, 2005

21

Analysis of hot-carrier degradation in a SOI LDMOS transistor with a steep retrograde drift doping profile

I. Cortés, J. Roig, D. Flores, J. Urresti, S. Hidalgo, J. Rebollo

Journal:

Microelectronics Reliability

Year:

2005

Language:

english

File:

PDF, 513 KB

english, 2005

22

Chemical and diffusion-controlled curing kinetics of an underfill material

Journal:

Microelectronics Reliability

Year:

2005

Language:

english

File:

PDF, 347 KB

english, 2005

23

Verification of submodeling technique in thermomechanical reliability assessment of flip-chip package assembly

Yi-Shao Lai, Tong Hong Wang

Journal:

Microelectronics Reliability

Year:

2005

Language:

english

File:

PDF, 1.01 MB

english, 2005

24

Characterization of flexural and thermo-mechanical behavior of plastic ball grid package assembly using moiré interferometry

Jinwon Joo, Seungmin Cho, Bongtae Han

Journal:

Microelectronics Reliability

Year:

2005

Language:

english

File:

PDF, 925 KB

english, 2005

25

Novel concepts for reliability technology

Dongsu Ryu, Seogweon Chang

Journal:

Microelectronics Reliability

Year:

2005

Language:

english

File:

PDF, 209 KB

english, 2005

26

Review of add-on process modules for high-frequency silicon technology

Journal:

Microelectronics Reliability

Year:

2005

Language:

english

File:

PDF, 383 KB

english, 2005

27

Gate dielectric breakdown in the time-scale of ESD events

Bonnie E. Weir, Che-Choi Leung, Paul J. Silverman, Muhammad A. Alam

Journal:

Microelectronics Reliability

Year:

2005

Language:

english

File:

PDF, 299 KB

english, 2005

28

Failure mechanisms in thermal inkjet printhead analyzed by experiments and numerical simulation

Ji-hyuk Lim, Keon Kuk, Seung-joo Shin, Seog-soon Baek, Young-jae Kim, Jong-woo Shin, Yong-soo Oh

Journal:

Microelectronics Reliability

Year:

2005

Language:

english

File:

PDF, 443 KB

english, 2005

29

Bipolar SCR ESD devices

V.A. Vashchenko, P. Hopper

Journal:

Microelectronics Reliability

Year:

2005

Language:

english

File:

PDF, 983 KB

english, 2005

30

The formation and growth of intermetallic compounds and shear strength at Sn–Zn solder/Au–Ni–Cu interfaces

K.S. Kim, K.W. Ryu, C.H. Yu, J.M. Kim

Journal:

Microelectronics Reliability

Year:

2005

Language:

english

File:

PDF, 1.17 MB

english, 2005

31

Measuring process capability based on CPK with gauge measurement errors

W.L. Pearn, Mou-Yuan Liao

Journal:

Microelectronics Reliability

Year:

2005

Language:

english

File:

PDF, 542 KB

english, 2005

32

Impact of gate-leakage currents on CMOS circuit performance

Alessandro Marras, Ilaria De Munari, Davide Vescovi, Paolo Ciampolini

Journal:

Microelectronics Reliability

Year:

2005

Language:

english

File:

PDF, 345 KB

english, 2005

33

MOS current divider based PGA

M. Teresa Sanz, Santiago Celma, Belén Calvo, Juan P. Alegre

Journal:

Microelectronics Reliability

Year:

2005

Language:

english

File:

PDF, 355 KB

english, 2005

34

Bandwidth of integrated photodiodes in standard CMOS for CD/DVD applications

Saša Radovanović, AnneJohan Annema, Bram Nauta

Journal:

Microelectronics Reliability

Year:

2005

Language:

english

File:

PDF, 158 KB

english, 2005

35

Improving reliability of beveled power semiconductor devices passivated by SIPOS

Ying Wang, Changchun Zhu, Chunyu Wu, Junhua Liu

Journal:

Microelectronics Reliability

Year:

2005

Language:

english

File:

PDF, 304 KB

english, 2005

36

Flip chip attachment on flexible LCP substrate using an ACF

L. Frisk, E. Ristolainen

Journal:

Microelectronics Reliability

Year:

2005

Language:

english

File:

PDF, 308 KB

english, 2005

37

Detailed study and projection of hard breakdown evolution in ultra-thin gate oxides

J.S. Suehle, B. Zhu, Y. Chen, J.B. Bernstein

Journal:

Microelectronics Reliability

Year:

2005

Language:

english

File:

PDF, 578 KB

english, 2005

38

A review of CMOS latchup and electrostatic discharge (ESD) in bipolar complimentary MOSFET (BiCMOS) Silicon Germanium technologies: Part II—Latchup

Steven H. Voldman

Journal:

Microelectronics Reliability

Year:

2005

Language:

english

File:

PDF, 309 KB

english, 2005