A study of post-etch wet clean on electrical and reliability performance of Cu/low k interconnections
C.F. Tsang, C.K. Chang, A. Krishnamoorthy, K.Y. Ee, Y.J. Su, H.Y. Li, W.H. Li, L.Y. WongVolume:
45
Year:
2005
Language:
english
Pages:
9
DOI:
10.1016/j.microrel.2004.07.007
File:
PDF, 666 KB
english, 2005