Vibration fatigue reliability of BGA-IC package with Pb-free solder and Pb–Sn solder
YoungBae Kim, Hiroshi Noguchi, Masazumi AmagaiVolume:
46
Year:
2006
Language:
english
Pages:
8
DOI:
10.1016/j.microrel.2005.02.003
File:
PDF, 382 KB
english, 2006