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Volume 46; Issue 2-4
Main
Microelectronics Reliability
Volume 46; Issue 2-4
Microelectronics Reliability
Volume 46; Issue 2-4
1
Electrostatic discharge protection scheme without leakage current path for CMOS IC operating in power-down-mode condition on a system board
Kun-Hsien Lin
,
Ming-Dou Ker
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 504 KB
Your tags:
english, 2006
2
Temperature profile effects in accelerated thermal cycling of SnPb and Pb-free solder joints
Yan Qi
,
Rex Lam
,
Hamid R. Ghorbani
,
Polina Snugovsky
,
Jan K. Spelt
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 900 KB
Your tags:
english, 2006
3
The surface characteristics of under bump metallurgy (UBM) in electroless nickel immersion gold (ENIG) deposition
Mohd Khairuddin Md Arshad
,
Ibrahim Ahmad
,
Azman Jalar
,
Ghazali Omar
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 1.01 MB
Your tags:
english, 2006
4
Vibration fatigue reliability of BGA-IC package with Pb-free solder and Pb–Sn solder
YoungBae Kim
,
Hiroshi Noguchi
,
Masazumi Amagai
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 382 KB
Your tags:
english, 2006
5
Sachin Sapatnekar, Timing, Kluwer Academic Publishers, Hardcover, ISBN 1-4020-7671-1, pp. 294, plus IX, € 123.
Mile Stojcev
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 60 KB
Your tags:
english, 2006
6
Thermal deformation measurements and predictions of MAP–BGA electronic packages
M.Y. Tsai
,
W.C. Chiang
,
T.M. Liu
,
G.H. Hsu
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 1.03 MB
Your tags:
english, 2006
7
An investigation into the effects of probing and wire bonding stress on the reliability of BOAC
K.M. Chen
,
B.C. Wu
,
K.H. Tang
,
F.Y. Cheng
,
N.H. Kao
,
J.Y. Lai
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 504 KB
Your tags:
english, 2006
8
Thermal analysis of bond layer influence on performance of an all-active vertically coupled, microring resonating laser
A.S. Fleischer
,
U. Troppenz
,
M. Hamacher
,
W. John
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 1.46 MB
Your tags:
english, 2006
9
Reliability study of underfill/chip interface under accelerated temperature cycling (ATC) loading
Y.L. Zhang
,
D.X.Q. Shi
,
W. Zhou
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 887 KB
Your tags:
english, 2006
10
Effects of process conditions on reliability, microstructure evolution and failure modes of SnAgCu solder joints
Periannan Arulvanan
,
Zhaowei Zhong
,
Xunqing Shi
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 449 KB
Your tags:
english, 2006
11
Moisture induced degradation of multilayer ceramic capacitors
Daniel N. Donahoe
,
Michael Pecht
,
Isabel K. Lloyd
,
Sanka Ganesan
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 297 KB
Your tags:
english, 2006
12
Processability and reliability of epoxy adhesive used in microelectronic devices linked to effects of degree of cure and damp heat aging
Jongwoo Park
,
John Osenbach
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 370 KB
Your tags:
english, 2006
13
A methodology for the calculation of stress migration in die-level interconnects
W. Dauksher
,
P. Marcoux
,
G. Castleman
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 357 KB
Your tags:
english, 2006
14
Thermal resistance analysis and validation of flip chip PBGA packages
Kuo-Ming Chen
,
Kuo-Hsiung Houng
,
Kuo-Ning Chiang
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 624 KB
Your tags:
english, 2006
15
Evaluation of displacement rate effect in shear test of Sn–3Ag–0.5Cu solder bump for flip chip application
Jong-Woong Kim
,
Dae-Gon Kim
,
Seung-Boo Jung
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 717 KB
Your tags:
english, 2006
16
Experimental characterization and mechanical behavior analysis of intermetallic compounds of Sn–3.5Ag lead-free solder bump with Ti/Cu/Ni UBM on copper chip
Chih-Tang Peng
,
Chia-Tai Kuo
,
Kuo-Ning Chiang
,
Terry Ku
,
Kenny Chang
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 726 KB
Your tags:
english, 2006
17
A numerical failure analysis on lead breakage issues of ultra fine pitch flip chip-on-flex and tape carrier packages during chip/film assembly process
Changsoo Jang
,
Seongyoung Han
,
Hangyu Kim
,
Sayoon Kang
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 646 KB
Your tags:
english, 2006
18
Experimental studies of board-level reliability of chip-scale packages subjected to JEDEC drop test condition
Yi-Shao Lai
,
Ping-Feng Yang
,
Chang-Lin Yeh
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 215 KB
Your tags:
english, 2006
19
Lead-free 0201 manufacturing, assembly and reliability test results
S. Manian Ramkumar
,
Reza Ghaffarian
,
Arun Varanasi
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 727 KB
Your tags:
english, 2006
20
Support excitation scheme for transient analysis of JEDEC board-level drop test
Chang-Lin Yeh
,
Yi-Shao Lai
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 400 KB
Your tags:
english, 2006
21
Numerical analysis of a double avalanche region IMPATT diode on the basis of nonlinear model
Alexander M. Zemliak
,
Roque De La Cruz
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 183 KB
Your tags:
english, 2006
22
Optical source reliability in recent optical fiber transmission systems and consumer electronics
Mitsuo Fukuda
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 129 KB
Your tags:
english, 2006
23
Low Power Electronics Design, Christian Pignet, Editor, CRC Press, Boca Raton, 2005, Hardcover, pp. 854, plus 18, ISBN 0-8493-1941-2
Mile Stojcev
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 60 KB
Your tags:
english, 2006
24
Temperature compensation of piezoresistive micro-machined porous silicon pressure sensor by ANN
C. Pramanik
,
T. Islam
,
H. Saha
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 371 KB
Your tags:
english, 2006
25
Hot-carrier reliability of submicron NMOSFETs and integrated NMOS low noise amplifiers
Sasan Naseh
,
M. Jamal Deen
,
Chih-Hung Chen
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 753 KB
Your tags:
english, 2006
26
Effect of wire diameter on the thermosonic bond reliability
Sarangapani Murali
,
Narasimalu Srikanth
,
Charles J. Vath III
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 437 KB
Your tags:
english, 2006
27
Determination of the thermal conductivity of composite low-k dielectrics for advanced interconnect structures
F. Chen
,
J. Gill
,
D. Harmon
,
T. Sullivan
,
A. Strong
,
B. Li
,
H. Rathore
,
D. Edelstein
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 590 KB
Your tags:
english, 2006
28
Bondability window and power input for wire bonding
Lei Han
,
Fuliang Wang
,
Wenhu Xu
,
Jue Zhong
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 332 KB
Your tags:
english, 2006
29
Solder reflow process induced residual warpage measurement and its influence on reliability of flip-chip electronic packages
Se Young Yang
,
Young-Doo Jeon
,
Soon-Bok Lee
,
Kyung-Wook Paik
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 674 KB
Your tags:
english, 2006
30
Deformation mechanism and its effect on electrical conductivity of ACF flip chip package under thermal cycling condition: An experimental study
Woon-Seong Kwon
,
Suk-Jin Ham
,
Kyung-Wook Paik
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 655 KB
Your tags:
english, 2006
31
An optical characterization technique for hygroscopic expansion of polymers and plastic packages
Fei Su
,
Kerm Sin Chian
,
Sung Yi
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 1.10 MB
Your tags:
english, 2006
32
Simplified quantitative stress-induced leakage current (SILC) model for MOS devices
M. Ossaimee
,
K. Kirah
,
W. Fikry
,
A. Girgis
,
O.A. Omar
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 224 KB
Your tags:
english, 2006
33
The negative bias temperature instability in MOS devices: A review
J.H. Stathis
,
S. Zafar
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 333 KB
Your tags:
english, 2006
34
Advanced electrical and stability characterization of untrimmed and variously trimmed thick-film and LTCC resistors
Andrzej Dziedzic
,
Andrzej Kolek
,
Waleed Ehrhardt
,
Heiko Thust
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 290 KB
Your tags:
english, 2006
35
Use of high temperature operating life data to mitigate risks in long-duration space applications that deploy commercial-grade plastic encapsulated semiconductor devices
Sanka Ganesan
,
Michael Pecht
,
Sharon Ling
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 115 KB
Your tags:
english, 2006
36
Thermal performance impacts of heat spreading lids on flip chip packages: With and without heat sinks
Jamil Wakil
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 234 KB
Your tags:
english, 2006
37
Oxidation of copper pads and its influence on the quality of Au/Cu bonds during thermosonic wire bonding process
Cheng-Li Chuang
,
Jong-Ning Aoh
,
Rong-Fong Din
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 462 KB
Your tags:
english, 2006
38
Residual compression in area array packages induced by underfill shrinkage
Michael C. Larson
,
Melody A. Verges
,
Xia Liu
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 299 KB
Your tags:
english, 2006
39
Modeling and simulation for a drop-impact analysis of multi-layered printed circuit boards
Yuqi Wang
,
K.H. Low
,
H.L.J. Pang
,
K.H. Hoon
,
F.X. Che
,
Y.S. Yong
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 936 KB
Your tags:
english, 2006
40
Electromigration of Cu/low dielectric constant interconnects
C.-K. Hu
,
L. Gignac
,
R. Rosenberg
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 1.33 MB
Your tags:
english, 2006
41
An unusual mechanical failure mode in gold ballbonds at 50 μm pitch due to degradation at the Au–Au4Al interface during ageing in air at 175 °C
C.D. Breach
,
F. Wulff
,
C.W. Tok
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 755 KB
Your tags:
english, 2006
42
Impact of the number of chips on the reliability of the solder balls for wire-bonded stacked-chip ball grid array packages
Yi-Ming Jen
,
Ying-Lung Wu
,
Chih-Kai Fang
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 459 KB
Your tags:
english, 2006
43
Single event burnout in power diodes: Mechanisms and models
A.M. Albadri
,
R.D. Schrimpf
,
K.F. Galloway
,
D.G. Walker
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 281 KB
Your tags:
english, 2006
44
Low temperature electrical measurements of silicon bipolar monolithic microwave integrated circuit (MMIC) amplifiers
Mohammadreza Keimasi
,
Sanka Ganesan
,
Michael Pecht
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 282 KB
Your tags:
english, 2006
45
X-ray ion mobility spectrometer
V.S. Pershenkov
,
A.D. Tremasov
,
V.V. Belyakov
,
A.U. Razvalyaev
,
V.S. Mochkin
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 202 KB
Your tags:
english, 2006
46
Effects of hot carriers in offset gated polysilicon thin-film transistors
A.T. Hatzopoulos
,
D.H. Tassis
,
N. Arpatzanis
,
C.A. Dimitriadis
,
G. Kamarinos
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 382 KB
Your tags:
english, 2006
47
Report on 4H–SiC JTE Schottky diodes
L. Chen
,
O.J. Guy
,
D. Doneddu
,
S.G.J. Batcup
,
S.P. Wilks
,
P.A. Mawby
,
T. Bouchet
,
F. Torregrosa
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 273 KB
Your tags:
english, 2006
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