Characteristics of current crowding in flip-chip solder...

Characteristics of current crowding in flip-chip solder bumps

Yi-Shao Lai, Chin-Li Kao
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Volume:
46
Year:
2006
Language:
english
Pages:
8
DOI:
10.1016/j.microrel.2005.02.007
File:
PDF, 520 KB
english, 2006
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