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Volume 46; Issue 5-6
Main
Microelectronics Reliability
Volume 46; Issue 5-6
Microelectronics Reliability
Volume 46; Issue 5-6
1
The effect of die attach voiding on the thermal resistance of chip level packages
Amy S. Fleischer
,
Li-hsin Chang
,
Barry C. Johnson
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 647 KB
Your tags:
english, 2006
2
Characteristics of current crowding in flip-chip solder bumps
Yi-Shao Lai
,
Chin-Li Kao
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 520 KB
Your tags:
english, 2006
3
On solution schemes for time-independent thermomechanical analysis for structures containing polymeric materials
Yi-Shao Lai
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 140 KB
Your tags:
english, 2006
4
A quantitative method of reliability estimation for surface mount solder joints based on heating factor Qη
Bo Tao
,
Yiping Wu
,
Han Ding
,
Y.L. Xiong
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 378 KB
Your tags:
english, 2006
5
Investigation of increased performance of close series stacked tube axial fans due to inclusion of diffuser element
J. Jilesen
,
F.S. Lien
,
H. Ahn
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 1.05 MB
Your tags:
english, 2006
6
Improvement in high-temperature degradation by isotropic conductive adhesives including Ag–Sn alloy fillers
M. Yamashita
,
K. Suganuma
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 811 KB
Your tags:
english, 2006
7
Statistical analysis of tin whisker growth
Tong Fang
,
Michael Osterman
,
Michael Pecht
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 101 KB
Your tags:
english, 2006
8
Development of bulk nanostructured copper with superior hardness for use as an interconnect material in electronic packaging
M.Y. Pan
,
M. Gupta
,
A.A.O. Tay
,
K. Vaidyanathan
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 856 KB
Your tags:
english, 2006
9
Resolution improvement of acoustic microimaging by continuous wavelet transform for semiconductor inspection
Guang-Ming Zhang
,
David M. Harvey
,
Derek R. Braden
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 419 KB
Your tags:
english, 2006
10
CFCET: A hardware-based control flow checking technique in COTS processors using execution tracing
Amir Rajabzadeh
,
Seyed Ghassem Miremadi
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 183 KB
Your tags:
english, 2006
11
Effect of wafer thinning methods towards fracture strength and topography of silicon die
Hoh Huey Jiun
,
Ibrahim Ahmad
,
Azman Jalar
,
Ghazali Omar
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 796 KB
Your tags:
english, 2006
12
Study of the power capability of LDMOS and the improved methods
Zhilin Sun
,
Weifeng Sun
,
Yangbo Yi
,
Longxing Shi
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 229 KB
Your tags:
english, 2006
13
Transient fracturing of solder joints subjected to displacement-controlled impact loads
Chang-Lin Yeh
,
Yi-Shao Lai
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 528 KB
Your tags:
english, 2006
14
Distributed collaborative design of IP components in the TRMS environment
K. Siekierska
,
P. Fraś
,
A. Kokoszka
,
T. Kostienko
,
N. Ługowski
,
D. Obrębski
,
A. Pawlak
,
P. Penkala
,
D. Stachańczyk
,
M. Szlęzak
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 305 KB
Your tags:
english, 2006
15
Gate oxide failures due to anomalous stress from HBM ESD testers
Charvaka Duvvury
,
Robert Steinhoff
,
Gianluca Boselli
,
Vijay Reddy
,
Hans Kunz
,
Steve Marum
,
Roger Cline
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 280 KB
Your tags:
english, 2006
16
ESD protection solutions for high voltage technologies
Bart Keppens
,
Markus P.J. Mergens
,
Cong Son Trinh
,
Christian C. Russ
,
Benjamin Van Camp
,
Koen G. Verhaege
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 729 KB
Your tags:
english, 2006
17
Reliability and performance limitations in SiC power devices
Ranbir Singh
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 549 KB
Your tags:
english, 2006
18
Experimental study on the thermo-mechanical effects of underfill and low-CTE substrate in a flip-chip device
Yasuyuki Morita
,
Kazuo Arakawa
,
Mitsugu Todo
,
Masayuki Kaneto
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 537 KB
Your tags:
english, 2006
19
Integrated CMOS GSM baseband channel selecting filters realized using switched capacitor finite impulse response technique
A. Dąbrowski
,
R. Długosz
,
P. Pawłowski
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 615 KB
Your tags:
english, 2006
20
A reliability-driven placement procedure based on thermal-force model
Jing Lee
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 317 KB
Your tags:
english, 2006
21
High temperature reliability and interfacial reaction of eutectic Sn–0.7Cu/Ni solder joints during isothermal aging
Jeong-Won Yoon
,
Seung-Boo Jung
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 950 KB
Your tags:
english, 2006
22
F. Mayer-Linderberg, ,Dedicated Digital Processors: Methods in Hardware/Software System Design (2004) John Wiley & Sons, Ltd.,Chichester 0-470-84444-2 Hardcover, pp. 302, plus XI, £ 55.
Mile Stojcev
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 63 KB
Your tags:
english, 2006
23
Implementation of plug-and-play ESD protection in 5.5 GHz 90 nm RF CMOS LNAs—Concepts, constraints and solutions
S. Thijs
,
M.I. Natarajan
,
D. Linten
,
W. Jeamsaksiri
,
T. Daenen
,
R. Degraeve
,
Andries Scholten
,
S. Decoutere
,
G. Groeseneken
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 424 KB
Your tags:
english, 2006
24
Nano-mechanical electro-thermal probe array used for high-density storage based on NEMS technology
Zunxian Yang
,
Ying Yu
,
Xinxin Li
,
Haifei Bao
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 365 KB
Your tags:
english, 2006
25
Characterisation of the Al2O3 films deposited by ultrasonic spray pyrolysis and atomic layer deposition methods for passivation of 4H–SiC devices
Maciej Wolborski
,
Mietek Bakowski
,
Armando Ortiz
,
Viljami Pore
,
Adolf Schöner
,
Mikko Ritala
,
Markku Leskelä
,
Anders Hallén
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 570 KB
Your tags:
english, 2006
26
Critical dimension control in photolithography based on the yield by a simulation program
H.Y. Kang
,
A.H.I. Lee
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 120 KB
Your tags:
english, 2006
27
Stress analysis and bending tests for GaAs wafers
W. Dreyer
,
F. Duderstadt
,
S. Eichler
,
M. Jurisch
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 618 KB
Your tags:
english, 2006
28
Feasibility study of the application of voltage contrast to printed circuit board
Cher Ming Tan
,
Zhenghao Gan
,
Tai Chong Chai
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 750 KB
Your tags:
english, 2006
29
Interfacial thermal stresses in solder joints of leadless chip resistors
H.R. Ghorbani
,
J.K. Spelt
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 421 KB
Your tags:
english, 2006
30
Isothermal aging effects on the microstructure and solder bump shear strength of eutectic Sn37Pb and Sn3.5Ag solders
W.-M. Chen
,
P. McCloskey
,
S.C. O’Mathuna
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 878 KB
Your tags:
english, 2006
31
Vertically high-density interconnection for mobile application
Takayoshi Katahira
,
Ilkka Kartio
,
Hiroshi Segawa
,
Michimasa Takahashi
,
Katsumi Sagisaka
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 514 KB
Your tags:
english, 2006
32
Study of RF N− LDMOS critical electrical parameter drifts after a thermal and electrical ageing in pulsed RF
H. Maanane
,
M. Masmoudi
,
J. Marcon
,
M.A. Belaid
,
K. Mourgues
,
C. Tolant
,
K. Ketata
,
Ph. Eudeline
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 292 KB
Your tags:
english, 2006
33
New insights into board level drop impact
E.H. Wong
,
Y.-W. Mai
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 302 KB
Your tags:
english, 2006
34
Effects of different bonding parameters on the electrical performance and peeling strengths of ACF interconnection
Xu Chen
,
Jun Zhang
,
Chunlei Jiao
,
Yanmin Liu
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 564 KB
Your tags:
english, 2006
35
Understanding threshold voltage in undoped-body MOSFETs: An appraisal of various criteria
F.J. Garcı́a Sánchez
,
A. Ortiz-Conde
,
J. Muci
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 289 KB
Your tags:
english, 2006
36
Life margin assessment with Physics of Failure Tools application to BGA packages
B. Foucher
,
J. Tomas
,
F. Mounsi
,
M. Jeremias
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 128 KB
Your tags:
english, 2006
37
Comparative studies of Pt and Ir schottky contacts on undoped Al0.36Ga0.64N
Y. Guhel
,
B. Boudart
,
E. Delos
,
M. Germain
,
Z. Bougrioua
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 159 KB
Your tags:
english, 2006
38
Physical fundamentals of external transient latch-up and corrective actions
K. Domański
,
B. Półtorak
,
S. Bargstädt-Franke
,
W. Stadler
,
W. Bała
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 1.04 MB
Your tags:
english, 2006
39
Study of CDM specific effects for a smart power input protection structure
M. Etherton
,
N. Qu
,
J. Willemen
,
W. Wilkening
,
S. Mettler
,
M. Dissegna
,
R. Stella
,
L. Zullino
,
A. Andreini
,
H. Gieser
,
H. Wolf
,
W. Fichtner
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 466 KB
Your tags:
english, 2006
40
Investigation of the influence of thermal treatment on interconnect-barrier interfaces in copper metallization systems
Oliver Aubel
,
Eberhard Bugiel
,
Dietmar Krüger
,
Wolfgang Hasse
,
Martina Hommel
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 302 KB
Your tags:
english, 2006
41
Introduction to special section on selected papers from EOS/ESD Symposium 2004
Natarajan Mahadeva Iyer
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 42 KB
Your tags:
english, 2006
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