An investigation into the effects of probing and wire...

Microelectronics Reliability 2006 Vol. 46; Iss. 2-4

An investigation into the effects of probing and wire bonding stress on the reliability of BOAC

K.M. Chen, B.C. Wu, K.H. Tang, F.Y. Cheng, N.H. Kao, J.Y. Lai
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Volume:
46
Year:
2006
Language:
english
Pages:
8
DOI:
10.1016/j.microrel.2005.02.016
File:
PDF, 504 KB
english, 2006
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