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A quantitative method of reliability estimation for surface mount solder joints based on heating factor Qη
Bo Tao, Yiping Wu, Han Ding, Y.L. XiongVolume:
46
Year:
2006
Language:
english
Pages:
9
DOI:
10.1016/j.microrel.2005.04.013
File:
PDF, 378 KB
english, 2006