Thermal resistance analysis and validation of flip chip PBGA packages
Kuo-Ming Chen, Kuo-Hsiung Houng, Kuo-Ning ChiangVolume:
46
Year:
2006
Language:
english
Pages:
9
DOI:
10.1016/j.microrel.2005.06.001
File:
PDF, 624 KB
english, 2006