Thermal resistance analysis and validation of flip chip...

Thermal resistance analysis and validation of flip chip PBGA packages

Kuo-Ming Chen, Kuo-Hsiung Houng, Kuo-Ning Chiang
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
46
Year:
2006
Language:
english
Pages:
9
DOI:
10.1016/j.microrel.2005.06.001
File:
PDF, 624 KB
english, 2006
Conversion to is in progress
Conversion to is failed