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Reliability and RF performance of BGA solder joints with plastic-core solder balls in LTCC/PWB assemblies
T. Kangasvieri, O. Nousiainen, J. Putaala, R. Rautioaho, J. VähäkangasVolume:
46
Year:
2006
Language:
english
Pages:
13
DOI:
10.1016/j.microrel.2005.11.003
File:
PDF, 578 KB
english, 2006