Volume 46; Issue 8

Microelectronics Reliability

Volume 46; Issue 8

1

Application of polyimide to bending-mode microactuators with Ni/Fe and Fe/Pt magnet

C.T. Pan, P.J. Cheng, C.K. Yen, C.C. Hsieh

Journal:

Microelectronics Reliability

Year:

2006

Language:

english

File:

PDF, 672 KB

english, 2006

2

Study of dc conduction mechanisms in dysprosium–manganese oxide insulator thin films grown on Si substrates

Journal:

Microelectronics Reliability

Year:

2006

Language:

english

File:

PDF, 160 KB

english, 2006

3

Reliability and RF performance of BGA solder joints with plastic-core solder balls in LTCC/PWB assemblies

T. Kangasvieri, O. Nousiainen, J. Putaala, R. Rautioaho, J. Vähäkangas

Journal:

Microelectronics Reliability

Year:

2006

Language:

english

File:

PDF, 578 KB

english, 2006

4

Analogue electronic circuit diagnosis based on ANNs

Vančo Litovski, Miona Andrejević, Mark Zwolinski

Journal:

Microelectronics Reliability

Year:

2006

Language:

english

File:

PDF, 181 KB

english, 2006

5

Numerical and experimental analysis of the Sn3.5Ag0.75Cu solder joint reliability under thermal cycling

H.T. Chen, C.Q. Wang, M.Y. Li

Journal:

Microelectronics Reliability

Year:

2006

Language:

english

File:

PDF, 863 KB

english, 2006

6

Design of a novel chip on glass package solution for CMOS image sensor device

Ching-Yang Chen, Yung-Ching Chao, De-Shin Liu, Zhen-Wei Zhuang

Journal:

Microelectronics Reliability

Year:

2006

Language:

english

File:

PDF, 484 KB

english, 2006

7

Determining factors affecting ESD failure voltage using DOE

Charles Whitman, Terri M. Gilbert, Ann M. Rahn, Jennifer A. Antonell

Journal:

Microelectronics Reliability

Year:

2006

Language:

english

File:

PDF, 233 KB

english, 2006

8

Reliability of large periphery GaN-on-Si HFETs

S. Singhal, T. Li, A. Chaudhari, A.W. Hanson, R. Therrien, J.W. Johnson, W. Nagy, J. Marquart, P. Rajagopal, J.C. Roberts, E.L. Piner, I.C. Kizilyalli, K.J. Linthicum

Journal:

Microelectronics Reliability

Year:

2006

Language:

english

File:

PDF, 435 KB

english, 2006

9

2006 IEEE International Integrated Reliability Workshop (IIRW)

Journal:

Microelectronics Reliability

Year:

2006

File:

PDF, 209 KB

2006

10

Electrothermal coupling analysis of current crowding and Joule heating in flip-chip packages

Yi-Shao Lai, Chin-Li Kao

Journal:

Microelectronics Reliability

Year:

2006

Language:

english

File:

PDF, 847 KB

english, 2006

11

Mechanical reliability of Au and Cu wire bonds to Al, Ni/Au and Ni/Pd/Au capped Cu bond pads

Petar Ratchev, Serguei Stoukatch, Bart Swinnen

Journal:

Microelectronics Reliability

Year:

2006

Language:

english

File:

PDF, 663 KB

english, 2006

12

A direct measurement of electromigration induced drift velocity in Cu dual damascene interconnects

M.Y. Yan, K.N. Tu, A.V. Vairagar, S.G. Mhaisalkar, Ahila Krishnamoorthy

Journal:

Microelectronics Reliability

Year:

2006

Language:

english

File:

PDF, 221 KB

english, 2006

13

Reliability studies of barrier layers for Cu/PAE low-k interconnects

H.S. Nguyen, Z.H. Gan, Zhe Chen, V. Chandrasekar, K. Prasad, S.G. Mhaisalkar, Ning Jiang

Journal:

Microelectronics Reliability

Year:

2006

Language:

english

File:

PDF, 405 KB

english, 2006

14

Alfredo Benso, Paolo Prinetto, editors, Fault injection techniques and tools for embedded systems reliability and evaluation, Kluwer Academic Publishers, Boston, 2003. Hardcover, pp. 241, plus XIV, 104 euro. ISBN 1-4020-7589-8

Journal:

Microelectronics Reliability

Year:

2006

Language:

english

File:

PDF, 57 KB

english, 2006

15

Design of field-plate terminated 4H-SiC Schottky diodes using high-k dielectrics

A. Kumta, Rusli, Chin-Che Tin, J. Ahn

Journal:

Microelectronics Reliability

Year:

2006

Language:

english

File:

PDF, 256 KB

english, 2006

16

Editorial

Peter Ersland, Roberto Menozzi

Journal:

Microelectronics Reliability

Year:

2006

Language:

english

File:

PDF, 45 KB

english, 2006

17

Reliability results of HBTs with an InGaP emitter

Charles S. Whitman

Journal:

Microelectronics Reliability

Year:

2006

Language:

english

File:

PDF, 262 KB

english, 2006

18

Reliability investigation and characterization of failure modes in Schottky diodes

Shivarajiv Somisetty, Peter Ersland, Xinxing Yang, Jason Barrett

Journal:

Microelectronics Reliability

Year:

2006

Language:

english

File:

PDF, 498 KB

english, 2006

19

Historical review of compound semiconductor reliability

William J. Roesch

Journal:

Microelectronics Reliability

Year:

2006

Language:

english

File:

PDF, 240 KB

english, 2006

20

Evaluation of SiGe:C HBT intrinsic reliability using conventional and step stress methodologies

Craig Gaw, T. Arnold, R. Martin, L. Zhang, D. Zupac

Journal:

Microelectronics Reliability

Year:

2006

Language:

english

File:

PDF, 506 KB

english, 2006

21

Sachin Sapatnekar, Timing, Kluwer Academic Publishers, Hardcover, pp. 294, plus IX, euro 123. ISBN 1-4020-7671-1

Journal:

Microelectronics Reliability

Year:

2006

Language:

english

File:

PDF, 54 KB

english, 2006

22

On-chip electrostatic discharge protection for CMOS gas sensor systems-on-a-chip (SoC)

Javier A. Salcedo, Juin J. Liou, Muhammad Y. Afridi, Allen R. Hefner Jr.

Journal:

Microelectronics Reliability

Year:

2006

Language:

english

File:

PDF, 439 KB

english, 2006

23

Compound semiconductor activation energy in humidity

William J. Roesch

Journal:

Microelectronics Reliability

Year:

2006

Language:

english

File:

PDF, 532 KB

english, 2006

24

Wear out failure mechanisms in aluminium and gold based LDMOS RF power applications

P.J. van der Wel, S.J.C.H. Theeuwen, J.A. Bielen, Y. Li, R.A. van den Heuvel, J.G. Gommans, F. van Rijs, P. Bron, H.J.F. Peuscher

Journal:

Microelectronics Reliability

Year:

2006

Language:

english

File:

PDF, 282 KB

english, 2006

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