Effects of pre-bump probing and bumping processes on...

Effects of pre-bump probing and bumping processes on eutectic solder bump electromigration

Kuo-Ming Chen, J.D. Wu, Kuo-Ning Chiang
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Volume:
46
Year:
2006
Language:
english
Pages:
8
DOI:
10.1016/j.microrel.2006.01.005
File:
PDF, 474 KB
english, 2006
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