Volume 46; Issue 12

Microelectronics Reliability

Volume 46; Issue 12

1

Electronic circuit reliability modeling

Joseph B. Bernstein, Moshe Gurfinkel, Xiaojun Li, Jörg Walters, Yoram Shapira, Michael Talmor

Journal:

Microelectronics Reliability

Year:

2006

Language:

english

File:

PDF, 535 KB

english, 2006

2

Determination of thermal resistance using Gummel measurement for InGaP/GaAs HBTs

Yang-Hua Chang, Hui-Fen Hsu

Journal:

Microelectronics Reliability

Year:

2006

Language:

english

File:

PDF, 149 KB

english, 2006

3

Effects of pre-bump probing and bumping processes on eutectic solder bump electromigration

Kuo-Ming Chen, J.D. Wu, Kuo-Ning Chiang

Journal:

Microelectronics Reliability

Year:

2006

Language:

english

File:

PDF, 474 KB

english, 2006

4

Current-dependent hot-electron stresses on InGaP-gated and AlGaAs-gated low noise PHEMTs

Hou-Kuei Huang, Cieh-Pin Chang, Mau-Phon Houng, Yeong-Her Wang

Journal:

Microelectronics Reliability

Year:

2006

Language:

english

File:

PDF, 566 KB

english, 2006

5

Dynamic hot-carrier induced degradation in n-channel polysilicon thin-film transistors

D.H. Tassis, A.T. Hatzopoulos, N. Arpatzanis, C.A. Dimitriadis, G. Kamarinos

Journal:

Microelectronics Reliability

Year:

2006

Language:

english

File:

PDF, 192 KB

english, 2006

6

Transistor-level to gate-level comprehensive fault synthesis for n-input primitive gates

Reza Sedaghat, Mayuri Kunchwar, Raha Abedi, Reza Javaheri

Journal:

Microelectronics Reliability

Year:

2006

Language:

english

File:

PDF, 219 KB

english, 2006

7

A review of gate tunneling current in MOS devices

Juan C. Ranuárez, M.J. Deen, Chih-Hung Chen

Journal:

Microelectronics Reliability

Year:

2006

Language:

english

File:

PDF, 432 KB

english, 2006

8

Influence of TCE concentration in thermal oxidation on reliability of SiC MOS capacitors under Fowler–Nordheim electron injection

B.L. Yang, Paul C.K. Kwok, P.T. Lai

Journal:

Microelectronics Reliability

Year:

2006

Language:

english

File:

PDF, 192 KB

english, 2006

9

Oxidation of Au4Al in un-moulded gold ballbonds after high temperature storage (HTS) in air at 175 °C

C.D. Breach, F. Wulff

Journal:

Microelectronics Reliability

Year:

2006

Language:

english

File:

PDF, 694 KB

english, 2006

10

Minimizing hydrogen content in silicon oxynitride by thermal oxidation of silicon-rich silicon nitride

C.K. Wong, H. Wong, M. Chan, C.W. Kok, H.P. Chan

Journal:

Microelectronics Reliability

Year:

2006

Language:

english

File:

PDF, 519 KB

english, 2006

11

ESD robustness of thin-film devices with different layout structures in LTPS technology

Chih-Kang Deng, Ming-Dou Ker

Journal:

Microelectronics Reliability

Year:

2006

Language:

english

File:

PDF, 975 KB

english, 2006

12

Failure mechanisms of pure silver, pure aluminum and silver–aluminum alloy under high current stress

E. Misra, N.D. Theodore, J.W. Mayer, T.L. Alford

Journal:

Microelectronics Reliability

Year:

2006

Language:

english

File:

PDF, 361 KB

english, 2006

13

Novel charge neutralization techniques applicable to wide current range of FIB processing in FIB-SEM combined system

Hirotaka Komoda, Masaaki Yoshida, Yoh Yamamoto, Kouji Iwasaki, Ikuko Nakatani, Heiji Watanabe, Kiyoshi Yasutake

Journal:

Microelectronics Reliability

Year:

2006

Language:

english

File:

PDF, 513 KB

english, 2006

14

Investigations of transient thermal properties of conductively cooled diode laser arrays operating under quasicontinuous-wave conditions

Anna Kozlowska, Andrzej Maląg

Journal:

Microelectronics Reliability

Year:

2006

Language:

english

File:

PDF, 352 KB

english, 2006

15

Assessing the performance of crack detection tests for solder joints

Stephen Ridout, Milos Dusek, Chris Bailey, Chris Hunt

Journal:

Microelectronics Reliability

Year:

2006

Language:

english

File:

PDF, 1.67 MB

english, 2006

16

Effect of annealing on the properties of low-k nanoporous SiO2 films prepared by sol–gel method with catalyst HF

Z.W. He, X.Q. Liu, D.Y. Xu, Y.Y. Wang

Journal:

Microelectronics Reliability

Year:

2006

Language:

english

File:

PDF, 262 KB

english, 2006

17

CCGA packages for space applications

Reza Ghaffarian

Journal:

Microelectronics Reliability

Year:

2006

Language:

english

File:

PDF, 2.30 MB

english, 2006

18

Author Index for Volume 46

Journal:

Microelectronics Reliability

Year:

2006

Language:

english

File:

PDF, 71 KB

english, 2006

19

Application of three-parameter lognormal distribution in EM data analysis

Baozhen Li, Emmanuel Yashchin, Cathryn Christiansen, Jason Gill, Ronald Filippi, Timothy Sullivan

Journal:

Microelectronics Reliability

Year:

2006

Language:

english

File:

PDF, 565 KB

english, 2006

20

Using intuitionistic fuzzy sets for fault-tree analysis on printed circuit board assembly

Ming-Hung Shu, Ching-Hsue Cheng, Jing-Rong Chang

Journal:

Microelectronics Reliability

Year:

2006

Language:

english

File:

PDF, 362 KB

english, 2006

21

Board level solder joint reliability analysis of stacked die mixed flip-chip and wirebond BGA

Tong Yan Tee, Hun Shen Ng, Zhaowei Zhong

Journal:

Microelectronics Reliability

Year:

2006

Language:

english

File:

PDF, 342 KB

english, 2006

22

Hot-electron effects on AlGaAs/InGaAs/GaAs PHEMTs under accelerated DC stresses

Hou-Kuei Huang, Chou-Sern Wang, Mau-Phon Houng, Yeong-Her Wang

Journal:

Microelectronics Reliability

Year:

2006

Language:

english

File:

PDF, 259 KB

english, 2006

23

Erratum to “Reliability results of HBTs with an InGaP emitter” [Microelectron. Reliab. 46 (2006) 1261–1271]

Charles S. Whitman

Journal:

Microelectronics Reliability

Year:

2006

Language:

english

File:

PDF, 53 KB

english, 2006

24

Erratum to “Determining factors affecting ESD failure voltage using DOE” [Microelectron. Reliab. 46 (2006) 1228–1237]

Charles Whitman, Terri M. Gilbert, Ann M. Rahn, Jennifer A. Antonell

Journal:

Microelectronics Reliability

Year:

2006

Language:

english

File:

PDF, 54 KB

english, 2006

25

Contents of volume 46

Journal:

Microelectronics Reliability

Year:

2006

Language:

english

File:

PDF, 112 KB

english, 2006

26

Technologies and reliability of modern embedded flash cells

Axel Sikora, Frank-Peter Pesl, Walter Unger, Uwe Paschen

Journal:

Microelectronics Reliability

Year:

2006

Language:

english

File:

PDF, 984 KB

english, 2006