![](/img/cover-not-exists.png)
Experimental investigation on the impact of stress free temperature on the electromigration performance of copper dual damascene submicron interconnect
Arijit Roy, Cher Ming TanVolume:
46
Year:
2006
Language:
english
Pages:
5
DOI:
10.1016/j.microrel.2006.07.036
File:
PDF, 428 KB
english, 2006