Experimental and statistical study in adhesion features of...

Microelectronics Reliability 2008 Vol. 48; Iss. 1

Experimental and statistical study in adhesion features of bonded interfaces of IC packages

Chi-Hui Chien, Thaiping Chen, Wei-Bang Lin, Chi-Chang Hsieh, Yii-Der Wu, Cheng-Hsiu Yeh
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Volume:
48
Year:
2008
Language:
english
Pages:
9
DOI:
10.1016/j.microrel.2007.03.002
File:
PDF, 179 KB
english, 2008
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