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Volume 48; Issue 1
Main
Microelectronics Reliability
Volume 48; Issue 1
Microelectronics Reliability
Volume 48; Issue 1
1
Joseph D. Dumas II, ,Computer Architecture: Fundamentals and Principles of Computer Design (2006) CRC Press an imprint of Taylor & Francis Group,Boca Raton 0-849-32749-0 Hardcover, pp. 372, plus XVI.
Mile Stojcev
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 63 KB
Your tags:
english, 2008
2
Navabi Zainalabedin, ,Verilog Digital System Design: Register Transfer Level Synthesis, Testbench, & Verification second ed. (2006) McGraw Hill,New York 0-07-144564-1 Hardcover, pp. 384, plus XVI.
Mile Stojcev
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 63 KB
Your tags:
english, 2008
3
Simultaneous mechanical and electrical straining of conventional thick-film resistors
Z. Stanimirović
,
M.M. Jevtić
,
I. Stanimirović
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 256 KB
Your tags:
english, 2008
4
Numerical analysis of ultrasonic wire bonding: Part 2. Effects of bonding parameters on temperature rise
Yong Ding
,
Jang-Kyo Kim
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 865 KB
Your tags:
english, 2008
5
A threshold voltage model for short-channel MOSFETs taking into account the varying depth of channel depletion layers around the source and drain
Srimanta Baishya
,
Abhijit Mallik
,
Chandan Kumar Sarkar
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 415 KB
Your tags:
english, 2008
6
Whisker growth on tin finishes of different electrolytes
Bo Jiang
,
Ai-Ping Xian
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 537 KB
Your tags:
english, 2008
7
A new electrothermal average model of the diode–transistor switch
Krzysztof Górecki
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 234 KB
Your tags:
english, 2008
8
Clock aligner based on delay locked loop with double edge synchronization
Mile Stojčev
,
Goran Jovanović
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 234 KB
Your tags:
english, 2008
9
Experimental and statistical study in adhesion features of bonded interfaces of IC packages
Chi-Hui Chien
,
Thaiping Chen
,
Wei-Bang Lin
,
Chi-Chang Hsieh
,
Yii-Der Wu
,
Cheng-Hsiu Yeh
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 179 KB
Your tags:
english, 2008
10
A study of nanoparticles in Sn–Ag based lead free solders
Masazumi Amagai
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 4.93 MB
Your tags:
english, 2008
11
A 2D threshold-voltage model for small MOSFET with quantum-mechanical effects
J.P. Xu
,
Y.P. Li
,
P.T. Lai
,
W.B. Chen
,
S.G. Xu
,
J.G. Guan
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 281 KB
Your tags:
english, 2008
12
Modeling the sensitivity of CMOS circuits to radiation induced single event transients
Gilson I. Wirth
,
Michele G. Vieira
,
Egas H. Neto
,
Fernanda Lima Kastensmidt
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 356 KB
Your tags:
english, 2008
13
Growth of tin whiskers for lead-free plated leadframe packages in high humid environments and during thermal cycling
Yoshikuni Nakadaira
,
Seyoung Jeong
,
Jongbo Shim
,
Jaiseok Seo
,
Sunhee Min
,
Taeje Cho
,
Sayoon Kang
,
Seyong Oh
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 5.92 MB
Your tags:
english, 2008
14
Reliability evaluations for board-level chip-scale packages under coupled power and thermal cycling test conditions
Tong Hong Wang
,
Yi-Shao Lai
,
Yu-Cheng Lin
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 870 KB
Your tags:
english, 2008
15
A strategy for damage assessment of thermally stressed copper vias in microelectronic printed circuit boards
K. Weinberg
,
W.H. Müller
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 2.36 MB
Your tags:
english, 2008
16
Douglas L. Perry, Harry D. Foster, Applied Formal Verification. Hardcover, p. 237, Plus XIV. New York: McGraw Hill; 2005, ISBN 0-07-144372-X.
Mile Stojcev
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 62 KB
Your tags:
english, 2008
17
Methodology of semiconductor devices classification into groups of differentiated quality
Alicja Konczakowska
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 235 KB
Your tags:
english, 2008
18
Packaging parameter analysis and optimization design on solder joint reliability for twin die stacked packages by variance in strain energy density (SED) of each solder joint
Chao-Yang Mao
,
Rong-Sheng Chen
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 1.35 MB
Your tags:
english, 2008
19
Investigation of relation between intermetallic and tin whisker growths under ambient condition
K.S. Kim
,
C.H. Yu
,
S.W. Han
,
K.C. Yang
,
J.H. Kim
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 1.86 MB
Your tags:
english, 2008
20
Electro-thermal modeling of multifinger AlGaN/GaN HEMT device operation including thermal substrate effects
E.R. Heller
,
A. Crespo
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 476 KB
Your tags:
english, 2008
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