![](/img/cover-not-exists.png)
Comparison of thermo-mechanical behavior of lead-free copper and tin–lead column grid array packages
S.B. Park, Rahul JoshiVolume:
48
Year:
2008
Language:
english
Pages:
10
DOI:
10.1016/j.microrel.2007.12.008
File:
PDF, 1.02 MB
english, 2008